Free PDF WIRE BONDING IN MICROELECTRONICS, 3/E
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WIRE BONDING IN MICROELECTRONICS, 3/E
Free PDF WIRE BONDING IN MICROELECTRONICS, 3/E
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About the Author
George G. Harman is a Fellow of the National Institute of Standards and Technology's Semiconductor Electronics Division.
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Product details
Hardcover: 446 pages
Publisher: McGraw-Hill Education; 3 edition (February 10, 2010)
Language: English
ISBN-10: 9780071476232
ISBN-13: 978-0071476232
ASIN: 0071476237
Product Dimensions:
6.4 x 1.2 x 9.4 inches
Shipping Weight: 1.6 pounds (View shipping rates and policies)
Average Customer Review:
4.7 out of 5 stars
7 customer reviews
Amazon Best Sellers Rank:
#775,149 in Books (See Top 100 in Books)
Wire Bonding in Microelectronics continues to be the definitive resource for wire bonding information.
The book is great! Both in quality of the book and on the content. It was a great help for me, especially on my field of work.
I had the first edition of this book which was printed in about 1989. The new edition has been expanded to include many more details on newer technologies such as wire bonding on no traditional surfaces such as immersion gold, and nickel palladium gold.
It took a lot longer then I expected to get shipped out but maybe they were out of stock and found one for me. If that is the case then that's awesome. I only paid $45 including shipping.
It's a great book by one of the leading authorities in wirebonding. George Harman knows the material science, reliability, process, and so many other details involved in wirebonding.
Good to read. It was helpfull for me.
This updated edition is a must have for anybody working in the wire bonding industry! Well done!
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